| Code: MTA10159 | Publication Date: Oct 2025 |
This expansion is ascribed to the increased demand for semiconductor packaging, miniaturization of electronics, and the increase in consumer electronics and automotive industries. This market is expected to capture an estimated market share of over 40% of the total semiconductor assembly and packaging sector by 2024.
The trends in OSAT show a continued push toward miniaturization with a more focused look at advanced packaging strategies such as 3D and system-in-package (SiP). More firms are investing in research and development into innovative packaging solutions to support the ongoing demands on 5G, IoT, and automotive applications. Furthermore, the market is experiencing a shift to more sustainable manufacturing practices, as firms shift focus toward reducing waste and increasing energy efficiency in production. The increased integration of artificial intelligence (AI) into design and packaging systems is also noteworthy.
The OSAT market is witnessing key developments including the rise of advanced packaging techniques like flip-chip and wafer-level packaging, which are gaining traction in response to the growing demand for high-performance chips. There is also a notable rise in the integration of 5G components, driving the need for more efficient packaging solutions. Evolving packaging solutions like microbumping and fan-out wafer-level packaging are expected to fuel growth, while e-commerce continues to be a vital channel for semiconductor-related sales, broadening market reach for OSAT providers.
Some of the leading companies include: