Market Forecast by Regions and Countries (North America, Europe, LATAM, Middle East, Asia Pacific and Africa), By Type (Manual Die Bonders, Semiautomatic Die Bonders, Fully Automatic Die Bonders), By Bonding Technique (Epoxy, Eutectic, Soft Solder, Others), By Supply Chain Participant (OSAT Companies, IDM Firms), By Device (Optoelectronics, MEMS and MOEMS, Power Devices), By Application (Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, Aerospace & Defense) And Competitive Landscape
| Product Code: ETC13190271 | Publication Date: Apr 2025 | Updated Date: Jul 2025 | Product Type: Market Research Report | |
| Publisher: 6Wresearch | Author: Ravi Bhandari | No. of Pages: 190 | No. of Figures: 80 | No. of Tables: 40 |
According to 6W research internal database and industry insights, the Global Die Bonder Equipment Market is projected to grow at a CAGR of 3.6% from 2025-2031. The Global Die Bonder Equipment Market was valued at USD 1.88 billion in 2024 and is expected to reach USD 2.31 billion by 2031.
| Report Name | Global Die Bonder Equipment Market |
| Forecast Period | 2025-2031 |
| CAGR | 3.6% |
| Market Size | USD 2.31 billion by 2031 |
| Growing Sector | Machinery and Equipment |
The Global Die Bonder Equipment Market report thoroughly covers the market by Regions and Countries, by Type, by Bonding Technique, by Supply Chain Participant, by Device, and by Application. The market report provides an unbiased and detailed analysis of the ongoing market trends, opportunities/high growth areas, and market drivers which would help the stakeholders to devise and align their market strategies according to the current and future market dynamics.
The Global die bonder equipment market is essenstial to semiconductor packaging by enabling the precise attachment of dies to substrates and lead frames. With the increasing demand for miniaturized electronics, 5G-enabled devices, automotive electronics, and high-performance computing, die bonding equipment has become increasingly indispensable. Improvements in throughput, alignment accuracy, and automation are redefining packaging operations. Notably, Asia-Pacific—led by Taiwan, China, Japan, and South Korea—is seeing continuous expansion due to its concentration of major foundries and outsourced semiconductor assembly and testing (OSAT) facilities that rely on next-gen bonding systems.
Global Die Bonder Equipment Market is expected to grow at a significant CAGR of 3.6% during the forecast period 2025-2031. The growing adoption of advanced consumer electronics, IoT devices, and automotive systems is a major driver of the die bonder equipment market. Increasing complexity in semiconductor packaging, including 2.5D/3D ICs and heterogeneous integration, requires highly precise and automated die placement solutions. Global Die Bonder Equipment Market Growth is further fueled by the transition to smaller nodes and rising demand for high-performance computing applications. Furthermore, expanding 5G infrastructure and rising investments in data centers are accelerating the demand for high-reliability semiconductors, in turn boosting the requirement for efficient die bonding systems across foundries and IDMs.
Despite rising growth potential, the Global die bonder equipment market faces several challenges. The High capital investment and operating costs remain a barrier for small and mid-sized semiconductor manufacturers. In addition, as devices become more complex and miniaturized, maintaining alignment precision and throughput becomes increasingly difficult. The ongoing chip shortage and disruptions in the global supply chain have affected equipment delivery schedules and slowed expansion plans. Furthermore, intense competition, especially from low-cost regional manufacturers, is pressuring global players to innovate continuously while managing production costs to maintain profitability.
The Emerging Global trends in the Global Die Bonder Equipment Industry include the integration of AI-based machine vision systems for improved placement accuracy and adaptive alignment. Adoption of fully automated die bonders with real-time process monitoring is gaining momentum, especially in high-volume manufacturing. The market is also facing a rising shift toward multi-die and flip-chip bonding to support 3D packaging and system-in-package (SiP) solutions. Moreover, the focus on advanced packaging for edge AI, automotive ADAS, and wearable electronics is creating demand for highly flexible and high-speed die bonders capable of handling varied die sizes and materials.
The push for next-gen semiconductor packaging and innovation is creating strong investment prospects in the die bonder equipment space. Key areas like 3D packaging, micro-LED assembly, and high-speed flip-chip bonding offer high potential. Asia-Pacific’s robust investment landscape, led by major semiconductor players and reinforced by public infrastructure initiatives, positions it as a prime growth region. Future returns are likely to come from innovations in AI-powered modular systems, increased R&D activity, and synergistic partnerships aimed at addressing evolving semiconductor packaging demands.
The Global Die Bonder Equipment Market is led by major players like Kulicke & Soffa, ASMPT, Palomar Technologies, BE Semiconductor Industries, and Shinkawa, all of which boast strong innovation capabilities and global networks. Focused on automation and hybrid bonding, these firms are actively developing high-performance solutions for fast-growing sectors including 5G and automotive electronics.
The Global Die Bonder Equipment Market is risingly shaped by national policies focused on semiconductor self-sufficiency. Government-backed programs such as the CHIPS Act, China’s tech roadmap, and India’s semiconductor incentives are stimulating local manufacturing and R&D. Environmental regulations tied to emissions, power consumption, and safety are driving equipment innovation. However, tightening export controls—especially in U.S.-China trade—are disrupting global flows of high-tech equipment, prompting firms to realign supply chains and navigate regional compliance requirements more carefully.
The Global Die Bonder Equipment Market is poised for sustained growth, driven by the global shift toward advanced packaging and high-density integration. Future growth of the die bonder equipment market will be fueled by cutting-edge technologies like chiplets, quantum chips, and silicon photonics, all of which require extreme precision. The push toward automation and digital control will further improve operational efficiency and quality. Beyond traditional electronics, the market is expected to expand into innovative domains like bioelectronic devices and flexible circuit systems.
The report offers a comprehensive study of the subsequent market segments and their leading categories.
According to Ritika Kalra, Senior Research Analyst, 6Wresearch, Asia dominates the global die bonder equipment market due to its concentration of semiconductor manufacturing hubs in countries like China, Taiwan, South Korea, and Japan. These nations host major foundries and OSAT providers, driving significant demand for high-speed, automated die bonding equipment. Robust government initiatives, advanced infrastructure, and a strong talent pool further reinforce the region’s leadership in this space.
Fully Automatic Die Bonders lead the market, due to their superior speed, accuracy, and integration capabilities suitable for high-volume semiconductor manufacturing. These systems support advanced packaging needs, reduce human error, and align with the industry's push toward automation and precision, making them the preferred choice among major semiconductor manufacturers.
The Epoxy bonding technique dominates the market due to its widespread applicability, cost-effectiveness, and compatibility with various devices and substrates. It is commonly used across consumer electronics, automotive, and MEMS devices, making it the most adopted bonding solution in die bonding applications.
OSAT Companies (Outsourced Semiconductor Assembly and Test) are the dominant participants in this market, as they handle large volumes of chip packaging and assembly for multiple global clients. Their reliance on high-throughput, cost-efficient, and flexible die bonding systems contributes to their leading share in equipment procurement.
Optoelectronics is the leading device segment, driven by the growing demand for image sensors, LEDs, laser diodes, and optical communication components. These devices require high-precision bonding for performance reliability, particularly in smartphones, automotive lighting, and high-speed data communication applications.
Consumer Electronics dominates the application segment due to the mass production of smartphones, tablets, laptops, and wearable devices. The need for miniaturized, high-performance chips has accelerated the adoption of advanced die bonding techniques in this sector, making it the largest end-use market.
The market report provides a detailed analysis of the following market segments:
| 1 Executive Summary |
| 2 Introduction |
| 2.1 Key Highlights of the Report |
| 2.2 Report Description |
| 2.3 Market Scope & Segmentation |
| 2.4 Research Methodology |
| 2.5 Assumptions |
| 3 Global Die Bonder Equipment Market Overview |
| 3.1 Global Regional Macro Economic Indicators |
| 3.2 Global Die Bonder Equipment Market Revenues & Volume, 2021 & 2031F |
| 3.3 Global Die Bonder Equipment Market - Industry Life Cycle |
| 3.4 Global Die Bonder Equipment Market - Porter's Five Forces |
| 3.5 Global Die Bonder Equipment Market Revenues & Volume Share, By Regions, 2021 & 2031F |
| 3.6 Global Die Bonder Equipment Market Revenues & Volume Share, By Type, 2021 & 2031F |
| 3.7 Global Die Bonder Equipment Market Revenues & Volume Share, By Bonding Technique, 2021 & 2031F |
| 3.8 Global Die Bonder Equipment Market Revenues & Volume Share, By Supply Chain Participant, 2021 & 2031F |
| 3.9 Global Die Bonder Equipment Market Revenues & Volume Share, By Device, 2021 & 2031F |
| 3.10 Global Die Bonder Equipment Market Revenues & Volume Share, By Application, 2021 & 2031F |
| 4 Global Die Bonder Equipment Market Dynamics |
| 4.1 Impact Analysis |
| 4.2 Market Drivers |
| 4.3 Market Restraints |
| 5 Global Die Bonder Equipment Market Trends |
| 6 Global Die Bonder Equipment Market, 2021 - 2031 |
| 6.1 Global Die Bonder Equipment Market, Revenues & Volume, By Type, 2021 - 2031 |
| 6.1.1 Overview & Analysis |
| 6.1.2 Global Die Bonder Equipment Market, Revenues & Volume, By Manual Die Bonders, 2021 - 2031 |
| 6.1.3 Global Die Bonder Equipment Market, Revenues & Volume, By Semiautomatic Die Bonders, 2021 - 2031 |
| 6.1.4 Global Die Bonder Equipment Market, Revenues & Volume, By Fully Automatic Die Bonders, 2021 - 2031 |
| 6.2 Global Die Bonder Equipment Market, Revenues & Volume, By Bonding Technique, 2021 - 2031 |
| 6.2.1 Overview & Analysis |
| 6.2.2 Global Die Bonder Equipment Market, Revenues & Volume, By Epoxy, 2021 - 2031 |
| 6.2.3 Global Die Bonder Equipment Market, Revenues & Volume, By Eutectic, 2021 - 2031 |
| 6.2.4 Global Die Bonder Equipment Market, Revenues & Volume, By Soft Solder, 2021 - 2031 |
| 6.2.5 Global Die Bonder Equipment Market, Revenues & Volume, By Others, 2021 - 2031 |
| 6.3 Global Die Bonder Equipment Market, Revenues & Volume, By Supply Chain Participant, 2021 - 2031 |
| 6.3.1 Overview & Analysis |
| 6.3.2 Global Die Bonder Equipment Market, Revenues & Volume, By OSAT Companies, 2021 - 2031 |
| 6.3.3 Global Die Bonder Equipment Market, Revenues & Volume, By IDM Firms, 2021 - 2031 |
| 6.4 Global Die Bonder Equipment Market, Revenues & Volume, By Device, 2021 - 2031 |
| 6.4.1 Overview & Analysis |
| 6.4.2 Global Die Bonder Equipment Market, Revenues & Volume, By Optoelectronics, 2021 - 2031 |
| 6.4.3 Global Die Bonder Equipment Market, Revenues & Volume, By MEMS and MOEMS, 2021 - 2031 |
| 6.4.4 Global Die Bonder Equipment Market, Revenues & Volume, By Power Devices, 2021 - 2031 |
| 6.5 Global Die Bonder Equipment Market, Revenues & Volume, By Application, 2021 - 2031 |
| 6.5.1 Overview & Analysis |
| 6.5.2 Global Die Bonder Equipment Market, Revenues & Volume, By Consumer Electronics, 2021 - 2031 |
| 6.5.3 Global Die Bonder Equipment Market, Revenues & Volume, By Automotive, 2021 - 2031 |
| 6.5.4 Global Die Bonder Equipment Market, Revenues & Volume, By Industrial, 2021 - 2031 |
| 6.5.5 Global Die Bonder Equipment Market, Revenues & Volume, By Telecommunications, 2021 - 2031 |
| 6.5.6 Global Die Bonder Equipment Market, Revenues & Volume, By Healthcare, 2021 - 2031 |
| 6.5.7 Global Die Bonder Equipment Market, Revenues & Volume, By Aerospace & Defense, 2021 - 2031 |
| 7 North America Die Bonder Equipment Market, Overview & Analysis |
| 7.1 North America Die Bonder Equipment Market Revenues & Volume, 2021 - 2031 |
| 7.2 North America Die Bonder Equipment Market, Revenues & Volume, By Countries, 2021 - 2031 |
| 7.2.1 United States (US) Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 7.2.2 Canada Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 7.2.3 Rest of North America Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 7.3 North America Die Bonder Equipment Market, Revenues & Volume, By Type, 2021 - 2031 |
| 7.4 North America Die Bonder Equipment Market, Revenues & Volume, By Bonding Technique, 2021 - 2031 |
| 7.5 North America Die Bonder Equipment Market, Revenues & Volume, By Supply Chain Participant, 2021 - 2031 |
| 7.6 North America Die Bonder Equipment Market, Revenues & Volume, By Device, 2021 - 2031 |
| 7.7 North America Die Bonder Equipment Market, Revenues & Volume, By Application, 2021 - 2031 |
| 8 Latin America (LATAM) Die Bonder Equipment Market, Overview & Analysis |
| 8.1 Latin America (LATAM) Die Bonder Equipment Market Revenues & Volume, 2021 - 2031 |
| 8.2 Latin America (LATAM) Die Bonder Equipment Market, Revenues & Volume, By Countries, 2021 - 2031 |
| 8.2.1 Brazil Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 8.2.2 Mexico Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 8.2.3 Argentina Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 8.2.4 Rest of LATAM Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 8.3 Latin America (LATAM) Die Bonder Equipment Market, Revenues & Volume, By Type, 2021 - 2031 |
| 8.4 Latin America (LATAM) Die Bonder Equipment Market, Revenues & Volume, By Bonding Technique, 2021 - 2031 |
| 8.5 Latin America (LATAM) Die Bonder Equipment Market, Revenues & Volume, By Supply Chain Participant, 2021 - 2031 |
| 8.6 Latin America (LATAM) Die Bonder Equipment Market, Revenues & Volume, By Device, 2021 - 2031 |
| 8.7 Latin America (LATAM) Die Bonder Equipment Market, Revenues & Volume, By Application, 2021 - 2031 |
| 9 Asia Die Bonder Equipment Market, Overview & Analysis |
| 9.1 Asia Die Bonder Equipment Market Revenues & Volume, 2021 - 2031 |
| 9.2 Asia Die Bonder Equipment Market, Revenues & Volume, By Countries, 2021 - 2031 |
| 9.2.1 India Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 9.2.2 China Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 9.2.3 Japan Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 9.2.4 Rest of Asia Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 9.3 Asia Die Bonder Equipment Market, Revenues & Volume, By Type, 2021 - 2031 |
| 9.4 Asia Die Bonder Equipment Market, Revenues & Volume, By Bonding Technique, 2021 - 2031 |
| 9.5 Asia Die Bonder Equipment Market, Revenues & Volume, By Supply Chain Participant, 2021 - 2031 |
| 9.6 Asia Die Bonder Equipment Market, Revenues & Volume, By Device, 2021 - 2031 |
| 9.7 Asia Die Bonder Equipment Market, Revenues & Volume, By Application, 2021 - 2031 |
| 10 Africa Die Bonder Equipment Market, Overview & Analysis |
| 10.1 Africa Die Bonder Equipment Market Revenues & Volume, 2021 - 2031 |
| 10.2 Africa Die Bonder Equipment Market, Revenues & Volume, By Countries, 2021 - 2031 |
| 10.2.1 South Africa Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 10.2.2 Egypt Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 10.2.3 Nigeria Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 10.2.4 Rest of Africa Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 10.3 Africa Die Bonder Equipment Market, Revenues & Volume, By Type, 2021 - 2031 |
| 10.4 Africa Die Bonder Equipment Market, Revenues & Volume, By Bonding Technique, 2021 - 2031 |
| 10.5 Africa Die Bonder Equipment Market, Revenues & Volume, By Supply Chain Participant, 2021 - 2031 |
| 10.6 Africa Die Bonder Equipment Market, Revenues & Volume, By Device, 2021 - 2031 |
| 10.7 Africa Die Bonder Equipment Market, Revenues & Volume, By Application, 2021 - 2031 |
| 11 Europe Die Bonder Equipment Market, Overview & Analysis |
| 11.1 Europe Die Bonder Equipment Market Revenues & Volume, 2021 - 2031 |
| 11.2 Europe Die Bonder Equipment Market, Revenues & Volume, By Countries, 2021 - 2031 |
| 11.2.1 United Kingdom Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 11.2.2 Germany Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 11.2.3 France Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 11.2.4 Rest of Europe Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 11.3 Europe Die Bonder Equipment Market, Revenues & Volume, By Type, 2021 - 2031 |
| 11.4 Europe Die Bonder Equipment Market, Revenues & Volume, By Bonding Technique, 2021 - 2031 |
| 11.5 Europe Die Bonder Equipment Market, Revenues & Volume, By Supply Chain Participant, 2021 - 2031 |
| 11.6 Europe Die Bonder Equipment Market, Revenues & Volume, By Device, 2021 - 2031 |
| 11.7 Europe Die Bonder Equipment Market, Revenues & Volume, By Application, 2021 - 2031 |
| 12 Middle East Die Bonder Equipment Market, Overview & Analysis |
| 12.1 Middle East Die Bonder Equipment Market Revenues & Volume, 2021 - 2031 |
| 12.2 Middle East Die Bonder Equipment Market, Revenues & Volume, By Countries, 2021 - 2031 |
| 12.2.1 Saudi Arabia Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 12.2.2 UAE Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 12.2.3 Turkey Die Bonder Equipment Market, Revenues & Volume, 2021 - 2031 |
| 12.3 Middle East Die Bonder Equipment Market, Revenues & Volume, By Type, 2021 - 2031 |
| 12.4 Middle East Die Bonder Equipment Market, Revenues & Volume, By Bonding Technique, 2021 - 2031 |
| 12.5 Middle East Die Bonder Equipment Market, Revenues & Volume, By Supply Chain Participant, 2021 - 2031 |
| 12.6 Middle East Die Bonder Equipment Market, Revenues & Volume, By Device, 2021 - 2031 |
| 12.7 Middle East Die Bonder Equipment Market, Revenues & Volume, By Application, 2021 - 2031 |
| 13 Global Die Bonder Equipment Market Key Performance Indicators |
| 14 Global Die Bonder Equipment Market - Export/Import By Countries Assessment |
| 15 Global Die Bonder Equipment Market - Opportunity Assessment |
| 15.1 Global Die Bonder Equipment Market Opportunity Assessment, By Countries, 2021 & 2031F |
| 15.2 Global Die Bonder Equipment Market Opportunity Assessment, By Type, 2021 & 2031F |
| 15.3 Global Die Bonder Equipment Market Opportunity Assessment, By Bonding Technique, 2021 & 2031F |
| 15.4 Global Die Bonder Equipment Market Opportunity Assessment, By Supply Chain Participant, 2021 & 2031F |
| 15.5 Global Die Bonder Equipment Market Opportunity Assessment, By Device, 2021 & 2031F |
| 15.6 Global Die Bonder Equipment Market Opportunity Assessment, By Application, 2021 & 2031F |
| 16 Global Die Bonder Equipment Market - Competitive Landscape |
| 16.1 Global Die Bonder Equipment Market Revenue Share, By Companies, 2024 |
| 16.2 Global Die Bonder Equipment Market Competitive Benchmarking, By Operating and Technical Parameters |
| 17 Top 10 Company Profiles |
| 18 Recommendations |
| 19 Disclaimer |