| Product Code: ETC4440625 | Publication Date: Jul 2023 | Product Type: Report | ||
| Publisher: 6Wresearch | Author: Ravi Bhandari | No. of Pages: 85 | No. of Figures: 45 | No. of Tables: 25 |
The India system in package market import shipment demonstrated strong growth, with a notable CAGR from 2020 to 2024. The market accelerated further between 2023 and 2024, indicating increasing momentum and expansion. The trend suggests a robust and thriving market for system in package imports.
The System in Package (SiP) market in India is experiencing substantial growth due to the increasing demand for miniaturization and integration of electronic components. SiP technology allows multiple functional blocks to be combined in a single package, enabling smaller, more efficient devices. This market is driven by the growing adoption of SiP in smartphones, IoT devices, and wearables. Additionally, the India electronics manufacturing sector is witnessing a surge, further boosting the SiP market.
The SiP market in India is witnessing growth due to the increasing complexity of electronic devices. SiP technology allows multiple components to be integrated into a single package, reducing the overall footprint. This is especially important in mobile devices and wearables. The demand for compact and multifunctional electronics is driving the SiP market. Additionally, the proliferation of IoT devices and the need for efficient, space-saving solutions further contribute to the market`s expansion in India.
The system-in-package market in India faces challenges related to miniaturization and thermal management. Ensuring the reliability and durability of densely packed components is a significant concern. Manufacturers must also grapple with compatibility issues and the need for advanced testing and validation processes.
The COVID-19 pandemic has had a significant impact on the System in Package (SiP) market in India. With lockdowns and disruptions in supply chains, the production and distribution of SiP components were affected. However, the demand for SiP solutions in sectors like telecommunications and consumer electronics increased as remote work and digitalization surged. This shift in demand has led to innovations in SiP technology to cater to changing market needs.
The India System-in-Package (SiP) market encompasses a blend of global giants and domestic companies. TSMC (Taiwan Semiconductor Manufacturing Company) is a significant global player in this market. As a leading semiconductor foundry, TSMC provides advanced SiP solutions, catering to various industries, including mobile, automotive, and IoT. In India, companies like Tata Consultancy Services (TCS) have a presence in the SiP market, offering end-to-end SiP design and manufacturing services. Additionally, VLSI Design Services, a domestic company, specializes in SiP solutions for the India electronics industry. These key players contribute to the growth and innovation in the SiP market in India, offering a wide range of integrated solutions for electronics and semiconductor applications.
1 Executive Summary |
2 Introduction |
2.1 Key Highlights of the Report |
2.2 Report Description |
2.3 Market Scope & Segmentation |
2.4 Research Methodology |
2.5 Assumptions |
3 India System in Package Market Overview |
3.1 India Country Macro Economic Indicators |
3.2 India System in Package Market Revenues & Volume, 2021 & 2031F |
3.3 India System in Package Market - Industry Life Cycle |
3.4 India System in Package Market - Porter's Five Forces |
3.5 India System in Package Market Revenues & Volume Share, By Packaging Technology , 2021 & 2031F |
3.6 India System in Package Market Revenues & Volume Share, By Package Type , 2021 & 2031F |
3.7 India System in Package Market Revenues & Volume Share, By Packaging Method , 2021 & 2031F |
3.8 India System in Package Market Revenues & Volume Share, By Application, 2021 & 2031F |
3.9 India System in Package Market Revenues & Volume Share, By Device, 2021 & 2031F |
4 India System in Package Market Dynamics |
4.1 Impact Analysis |
4.2 Market Drivers |
4.2.1 Increasing demand for miniaturization and compact electronic devices. |
4.2.2 Growing adoption of advanced packaging technologies in the electronics industry. |
4.2.3 Rising investments in research and development activities to enhance system in package (SiP) technology. |
4.3 Market Restraints |
4.3.1 High initial investment required for setting up SiP manufacturing facilities. |
4.3.2 Lack of standardized design and testing methodologies for SiP. |
4.3.3 Challenges related to thermal management and reliability of SiP solutions. |
5 India System in Package Market Trends |
6 India System in Package Market, By Types |
6.1 India System in Package Market, By Packaging Technology |
6.1.1 Overview and Analysis |
6.1.2 India System in Package Market Revenues & Volume, By Packaging Technology , 2021-2031F |
6.1.3 India System in Package Market Revenues & Volume, By 2D IC, 2021-2031F |
6.1.4 India System in Package Market Revenues & Volume, By 2.5D IC, 2021-2031F |
6.1.5 India System in Package Market Revenues & Volume, By 3D IC, 2021-2031F |
6.2 India System in Package Market, By Package Type |
6.2.1 Overview and Analysis |
6.2.2 India System in Package Market Revenues & Volume, By Ball Grid Array, 2021-2031F |
6.2.3 India System in Package Market Revenues & Volume, By Surface Mount Package, 2021-2031F |
6.2.4 India System in Package Market Revenues & Volume, By Pin Grid Array, 2021-2031F |
6.2.5 India System in Package Market Revenues & Volume, By Flat Package, 2021-2031F |
6.2.6 India System in Package Market Revenues & Volume, By Small Outline Package, 2021-2031F |
6.3 India System in Package Market, By Packaging Method |
6.3.1 Overview and Analysis |
6.3.2 India System in Package Market Revenues & Volume, By Fan-Out Wafer Level Packaging, 2021-2031F |
6.3.3 India System in Package Market Revenues & Volume, By Wire Bond & Die Attach, 2021-2031F |
6.3.4 India System in Package Market Revenues & Volume, By Flip Chip, 2021-2031F |
6.4 India System in Package Market, By Application |
6.4.1 Overview and Analysis |
6.4.2 India System in Package Market Revenues & Volume, By Automotive & Transportation, 2021-2031F |
6.4.3 India System in Package Market Revenues & Volume, By Consumer Electronics, 2021-2031F |
6.4.4 India System in Package Market Revenues & Volume, By Communication, 2021-2031F |
6.4.5 India System in Package Market Revenues & Volume, By Industrial, 2021-2031F |
6.4.6 India System in Package Market Revenues & Volume, By Aerospace & Defense, 2021-2031F |
6.4.7 India System in Package Market Revenues & Volume, By Healthcare, 2021-2031F |
6.5 India System in Package Market, By Device |
6.5.1 Overview and Analysis |
6.5.2 India System in Package Market Revenues & Volume, By RF Front-End, 2021-2031F |
6.5.3 India System in Package Market Revenues & Volume, By RF Power Amplifier, 2021-2031F |
6.5.4 India System in Package Market Revenues & Volume, By Power Management Integrated Circuits, 2021-2031F |
6.5.5 India System in Package Market Revenues & Volume, By Baseband Processor, 2021-2031F |
6.5.6 India System in Package Market Revenues & Volume, By Application Processor, 2021-2031F |
6.5.7 India System in Package Market Revenues & Volume, By Microelectromechanical System, 2021-2031F |
7 India System in Package Market Import-Export Trade Statistics |
7.1 India System in Package Market Export to Major Countries |
7.2 India System in Package Market Imports from Major Countries |
8 India System in Package Market Key Performance Indicators |
8.1 Average number of components integrated per SiP module. |
8.2 Percentage increase in adoption of SiP technology in key industries. |
8.3 Average time-to-market for new SiP products. |
8.4 Percentage reduction in overall system size achieved through SiP integration. |
8.5 Number of patents filed related to SiP technology. |
9 India System in Package Market - Opportunity Assessment |
9.1 India System in Package Market Opportunity Assessment, By Packaging Technology , 2021 & 2031F |
9.2 India System in Package Market Opportunity Assessment, By Package Type , 2021 & 2031F |
9.3 India System in Package Market Opportunity Assessment, By Packaging Method , 2021 & 2031F |
9.4 India System in Package Market Opportunity Assessment, By Application, 2021 & 2031F |
9.5 India System in Package Market Opportunity Assessment, By Device, 2021 & 2031F |
10 India System in Package Market - Competitive Landscape |
10.1 India System in Package Market Revenue Share, By Companies, 2024 |
10.2 India System in Package Market Competitive Benchmarking, By Operating and Technical Parameters |
11 Company Profiles |
12 Recommendations |
13 Disclaimer |