| Product Code: ETC5565952 | Publication Date: Nov 2023 | Updated Date: Nov 2025 | Product Type: Market Research Report | |
| Publisher: 6Wresearch | Author: Ravi Bhandari | No. of Pages: 60 | No. of Figures: 30 | No. of Tables: 5 |
The package import shipments system in Latvia experienced a significant increase in concentration levels from 2023 to 2024, with a very high concentration observed in 2024. The top countries exporting to Latvia in 2024 were the USA, Germany, China, Lithuania, and Poland. This sector has shown impressive growth, with a remarkable compound annual growth rate (CAGR) of 51.7% from 2020 to 2024. Moreover, the growth rate spiked even further in 2024, reaching 79.58%. These trends indicate a robust and rapidly expanding market for import shipments in Latvia, driven by key trading partners and strong demand.

1 Executive Summary |
2 Introduction |
2.1 Key Highlights of the Report |
2.2 Report Description |
2.3 Market Scope & Segmentation |
2.4 Research Methodology |
2.5 Assumptions |
3 Latvia System in Package Market Overview |
3.1 Latvia Country Macro Economic Indicators |
3.2 Latvia System in Package Market Revenues & Volume, 2021 & 2031F |
3.3 Latvia System in Package Market - Industry Life Cycle |
3.4 Latvia System in Package Market - Porter's Five Forces |
3.5 Latvia System in Package Market Revenues & Volume Share, By Packaging Technology , 2021 & 2031F |
3.6 Latvia System in Package Market Revenues & Volume Share, By Package Type , 2021 & 2031F |
3.7 Latvia System in Package Market Revenues & Volume Share, By Packaging Method , 2021 & 2031F |
3.8 Latvia System in Package Market Revenues & Volume Share, By Application, 2021 & 2031F |
3.9 Latvia System in Package Market Revenues & Volume Share, By Device, 2021 & 2031F |
4 Latvia System in Package Market Dynamics |
4.1 Impact Analysis |
4.2 Market Drivers |
4.2.1 Increasing demand for compact electronic devices |
4.2.2 Technological advancements in the semiconductor industry |
4.2.3 Growing adoption of System in Package (SiP) technology in various applications |
4.3 Market Restraints |
4.3.1 High initial investment for implementing SiP technology |
4.3.2 Complex design and manufacturing processes |
4.3.3 Limited availability of skilled workforce in the SiP technology sector |
5 Latvia System in Package Market Trends |
6 Latvia System in Package Market Segmentations |
6.1 Latvia System in Package Market, By Packaging Technology |
6.1.1 Overview and Analysis |
6.1.2 Latvia System in Package Market Revenues & Volume, By 2D IC, 2021-2031F |
6.1.3 Latvia System in Package Market Revenues & Volume, By 2.5D IC, 2021-2031F |
6.1.4 Latvia System in Package Market Revenues & Volume, By 3D IC, 2021-2031F |
6.2 Latvia System in Package Market, By Package Type |
6.2.1 Overview and Analysis |
6.2.2 Latvia System in Package Market Revenues & Volume, By Ball Grid Array, 2021-2031F |
6.2.3 Latvia System in Package Market Revenues & Volume, By Surface Mount Package, 2021-2031F |
6.2.4 Latvia System in Package Market Revenues & Volume, By Pin Grid Array, 2021-2031F |
6.2.5 Latvia System in Package Market Revenues & Volume, By Flat Package, 2021-2031F |
6.2.6 Latvia System in Package Market Revenues & Volume, By Small Outline Package, 2021-2031F |
6.3 Latvia System in Package Market, By Packaging Method |
6.3.1 Overview and Analysis |
6.3.2 Latvia System in Package Market Revenues & Volume, By Fan-Out Wafer Level Packaging, 2021-2031F |
6.3.3 Latvia System in Package Market Revenues & Volume, By Wire Bond & Die Attach, 2021-2031F |
6.3.4 Latvia System in Package Market Revenues & Volume, By Flip Chip, 2021-2031F |
6.4 Latvia System in Package Market, By Application |
6.4.1 Overview and Analysis |
6.4.2 Latvia System in Package Market Revenues & Volume, By Automotive & Transportation, 2021-2031F |
6.4.3 Latvia System in Package Market Revenues & Volume, By Consumer Electronics, 2021-2031F |
6.4.4 Latvia System in Package Market Revenues & Volume, By Communication, 2021-2031F |
6.4.5 Latvia System in Package Market Revenues & Volume, By Industrial, 2021-2031F |
6.4.6 Latvia System in Package Market Revenues & Volume, By Aerospace & Defense, 2021-2031F |
6.4.7 Latvia System in Package Market Revenues & Volume, By Healthcare, 2021-2031F |
6.5 Latvia System in Package Market, By Device |
6.5.1 Overview and Analysis |
6.5.2 Latvia System in Package Market Revenues & Volume, By RF Front-End, 2021-2031F |
6.5.3 Latvia System in Package Market Revenues & Volume, By RF Power Amplifier, 2021-2031F |
6.5.4 Latvia System in Package Market Revenues & Volume, By Power Management Integrated Circuits, 2021-2031F |
6.5.5 Latvia System in Package Market Revenues & Volume, By Baseband Processor, 2021-2031F |
6.5.6 Latvia System in Package Market Revenues & Volume, By Application Processor, 2021-2031F |
6.5.7 Latvia System in Package Market Revenues & Volume, By Microelectromechanical System, 2021-2031F |
7 Latvia System in Package Market Import-Export Trade Statistics |
7.1 Latvia System in Package Market Export to Major Countries |
7.2 Latvia System in Package Market Imports from Major Countries |
8 Latvia System in Package Market Key Performance Indicators |
8.1 Average time-to-market for new SiP products |
8.2 Rate of adoption of SiP technology in different industries |
8.3 Number of patents filed for SiP innovations |
8.4 Percentage of RD budget allocated to SiP technology development |
8.5 Efficiency of supply chain management for SiP components |
9 Latvia System in Package Market - Opportunity Assessment |
9.1 Latvia System in Package Market Opportunity Assessment, By Packaging Technology , 2021 & 2031F |
9.2 Latvia System in Package Market Opportunity Assessment, By Package Type , 2021 & 2031F |
9.3 Latvia System in Package Market Opportunity Assessment, By Packaging Method , 2021 & 2031F |
9.4 Latvia System in Package Market Opportunity Assessment, By Application, 2021 & 2031F |
9.5 Latvia System in Package Market Opportunity Assessment, By Device, 2021 & 2031F |
10 Latvia System in Package Market - Competitive Landscape |
10.1 Latvia System in Package Market Revenue Share, By Companies, 2024 |
10.2 Latvia System in Package Market Competitive Benchmarking, By Operating and Technical Parameters |
11 Company Profiles |
12 Recommendations | 13 Disclaimer |
Export potential enables firms to identify high-growth global markets with greater confidence by combining advanced trade intelligence with a structured quantitative methodology. The framework analyzes emerging demand trends and country-level import patterns while integrating macroeconomic and trade datasets such as GDP and population forecasts, bilateral import–export flows, tariff structures, elasticity differentials between developed and developing economies, geographic distance, and import demand projections. Using weighted trade values from 2020–2024 as the base period to project country-to-country export potential for 2030, these inputs are operationalized through calculated drivers such as gravity model parameters, tariff impact factors, and projected GDP per-capita growth. Through an analysis of hidden potentials, demand hotspots, and market conditions that are most favorable to success, this method enables firms to focus on target countries, maximize returns, and global expansion with data, backed by accuracy.
By factoring in the projected importer demand gap that is currently unmet and could be potential opportunity, it identifies the potential for the Exporter (Country) among 190 countries, against the general trade analysis, which identifies the biggest importer or exporter.
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