Epoxy molding compounds by Type held the highest share of the Taiwan Molding Compound Market -6Wresearch
In 2024, Epoxy molding compounds held the highest share in Taiwan’s molding compound market due to their superior mechanical strength, heat resistance, electrical insulation, and reliability in semiconductor encapsulation, making them the preferred choice for Taiwan’s large electronics and semiconductor manufacturing sector.
According to 6Wresearch, the Taiwan Molding Compound Market is projected to grow at a compound annual growth rate (CAGR) of 8.9% from 2025 to 2031. In recent years, Taiwan’s molding compound market demonstrated steady growth, primarily driven by its robust Electrical & Electronics (E&E) industry, which accounts for approximately 15% of the nation’s GDP. In 2024, semiconductor exports increased by 10.8%, while electronic component output surged nearly 20%, propelled by strong demand across 5G, AI, and electric vehicle (EV) sectors. High-performance epoxy and phenolic molding compounds have played a critical role in semiconductor packaging, PCB insulation, and optoelectronics applications.
Furthermore, the integrated circuit industry recorded significant output gains, especially in manufacturing and packaging, maintaining sustained demand for durable and reliable molding materials essential to advanced electronics.
In the projected timeframe, Taiwan’s molding compound market is well-positioned for continued expansion, supported by ambitious AI infrastructure initiatives and a rapidly growing EV sector. Significant government investments in AI robotics, silicon photonics, and quantum computing are expected to drive increased adoption of advanced materials such as bulk molding compounds (BMC) and sheet molding compounds (SMC).
Moreover, the EV market projected to grow nearly sixfold by 2030 would further stimulate demand for thermally stable, flame-retardant compounds tailored for battery systems and electronic components, coupled with a strong focus on sustainability and collaborative innovation, these trends would solidify Taiwan’s standing as a global leader in molding compounds for high-tech manufacturing.
According to Suryakant, Senior Research Analyst, 6Wresearch, Electronics & Electrical account for the largest share in Taiwan’s molding compound market, driven by the country’s strong semiconductor, PCB, and electronic component manufacturing base, where molding compounds are essential for encapsulation, insulation, and protecting devices from thermal, mechanical, and environmental stress.
Taiwan Molding Compound Market (2025-2031) report provides an in-depth analysis with 19 figures and 5 tables, covered in 70 pages. The report thoroughly covers mthe arket By Type, By End-User, By Resin Type, By Application. The Taiwan Molding Compound Market outlook report provides an unbiased and detailed analysis of the ongoing Taiwan Molding Compound Market trends, opportunities/high growth areas and market drivers which would help the stakeholders to devise and align their market strategies according to the current and future market dynamics.
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