How big is the fan-out panel level packaging market | Insights & Growth 2025

Q: What is the overall size of the fan-out panel level packaging market?

The fan-out panel level packaging market is expected to reach USD 911.6 million by 2031.

Q: What is the CAGR of the fan-out panel level packaging market?

The fan-out panel level packaging market is projected to grow at a CAGR of 14.9% over the forecast period.

Q: Which sectors are driving demand for FOPLP solutions?

Consumer electronics, automotive electronics, and telecommunications are key drivers.

Q: How is FOPLP different from fan-out wafer-level packaging?

FOPLP uses larger panel substrates, offering better scalability and cost advantages.

Q: How does 6W market outlook report help businesses in making decisions?

6W monitors the market across 60+ countries Globally, publishing an annual market outlook report that analyses trends, key drivers, Size, Volume, Revenue, opportunities, and market segments. This report offers comprehensive insights, helping businesses understand market dynamics and make informed decisions.

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Code: MTA6045

Publication Date: Jul 2025

How big is the fan-out panel level packaging market?

According to 6Wresearch internal database and industry insights, the fan-out panel level packaging (FOPLP) market was valued at approximately USD 340.7 million in 2024 and is projected to reach USD 911.6 million by 2031, expanding at CAGR of 14.9% during the forecast period.

The market is driven by rising demand for compact, high-performance semiconductor devices, growth in consumer electronics, and increasing adoption in automotive and 5G applications. The scalability of panel-level processing and advancements in substrate materials are also boosting adoption across industries.

Key Growth Factors of the Fan-out Panel Level Packaging Market

Rising miniaturization in electronic components
Expansion of 5G infrastructure and mobile device markets
Growing demand for advanced driver-assistance systems
Cost efficiency over wafer-level packaging
Surging interest from OSAT and foundry players
Technological advancements in large panel manufacturing

Fan-out Panel Level Packaging Market Trends

The market is seeing a trend toward heterogeneous integration, enabling multi-die packaging for complex applications. There is also an increasing shift to larger panel sizes to reduce cost per package. AI and high-performance computing (HPC) are accelerating demand for advanced packaging solutions.

Emerging Developments in the Fan-out Panel Level Packaging Market

Chiplet integration using FOPLP, improved redistribution layer (RDL) technologies, and the adoption of glass substrates for better electrical performance are included in the emerging developments in the fan-out panel level packaging market. Collaborations between material providers and OSAT companies are fostering next-gen FOPLP platforms.