| Product Code: ETC11761797 | Publication Date: Apr 2025 | Updated Date: Oct 2025 | Product Type: Market Research Report | |
| Publisher: 6Wresearch | No. of Pages: 65 | No. of Figures: 34 | No. of Tables: 19 | |
The import shipments of copper wire bonding ICs in China saw a decline in both the compound annual growth rate (CAGR) and the growth rate from 2023 to 2024. Despite the decrease, top exporting countries Japan, Taiwan, South Korea, Germany, and Malaysia continued to contribute significantly. The market remained relatively competitive with low concentration, as indicated by the Herfindahl-Hirschman Index (HHI). This suggests a diverse and dynamic market landscape for copper wire bonding ICs in China, with key players from various countries playing a role in shaping the industry`s trajectory.

1 Executive Summary |
2 Introduction |
2.1 Key Highlights of the Report |
2.2 Report Description |
2.3 Market Scope & Segmentation |
2.4 Research Methodology |
2.5 Assumptions |
3 China Copper Wire Bonding ICs Market Overview |
3.1 China Country Macro Economic Indicators |
3.2 China Copper Wire Bonding ICs Market Revenues & Volume, 2021 & 2031F |
3.3 China Copper Wire Bonding ICs Market - Industry Life Cycle |
3.4 China Copper Wire Bonding ICs Market - Porter's Five Forces |
3.5 China Copper Wire Bonding ICs Market Revenues & Volume Share, By Wire Type, 2021 & 2031F |
3.6 China Copper Wire Bonding ICs Market Revenues & Volume Share, By Bonding Process, 2021 & 2031F |
3.7 China Copper Wire Bonding ICs Market Revenues & Volume Share, By Application, 2021 & 2031F |
3.8 China Copper Wire Bonding ICs Market Revenues & Volume Share, By End User, 2021 & 2031F |
3.9 China Copper Wire Bonding ICs Market Revenues & Volume Share, By Distribution Channel, 2021 & 2031F |
4 China Copper Wire Bonding ICs Market Dynamics |
4.1 Impact Analysis |
4.2 Market Drivers |
4.2.1 Increasing demand for consumer electronics and automotive electronics in China |
4.2.2 Growing adoption of advanced packaging technologies in the semiconductor industry |
4.2.3 Technological advancements in copper wire bonding technology |
4.3 Market Restraints |
4.3.1 Fluctuating prices of raw materials used in copper wire bonding ICs production |
4.3.2 Intense competition from other packaging technologies like flip chip bonding |
4.3.3 Regulatory challenges and compliance requirements in the semiconductor industry |
5 China Copper Wire Bonding ICs Market Trends |
6 China Copper Wire Bonding ICs Market, By Types |
6.1 China Copper Wire Bonding ICs Market, By Wire Type |
6.1.1 Overview and Analysis |
6.1.2 China Copper Wire Bonding ICs Market Revenues & Volume, By Wire Type, 2021 - 2031F |
6.1.3 China Copper Wire Bonding ICs Market Revenues & Volume, By Thin Wire, 2021 - 2031F |
6.1.4 China Copper Wire Bonding ICs Market Revenues & Volume, By Thick Wire, 2021 - 2031F |
6.1.5 China Copper Wire Bonding ICs Market Revenues & Volume, By Ultra-fine Wire, 2021 - 2031F |
6.1.6 China Copper Wire Bonding ICs Market Revenues & Volume, By Others, 2021 - 2031F |
6.2 China Copper Wire Bonding ICs Market, By Bonding Process |
6.2.1 Overview and Analysis |
6.2.2 China Copper Wire Bonding ICs Market Revenues & Volume, By Thermocompression, 2021 - 2031F |
6.2.3 China Copper Wire Bonding ICs Market Revenues & Volume, By Ultrasonic Bonding, 2021 - 2031F |
6.2.4 China Copper Wire Bonding ICs Market Revenues & Volume, By Thermosonic Bonding, 2021 - 2031F |
6.2.5 China Copper Wire Bonding ICs Market Revenues & Volume, By Others, 2021 - 2031F |
6.3 China Copper Wire Bonding ICs Market, By Application |
6.3.1 Overview and Analysis |
6.3.2 China Copper Wire Bonding ICs Market Revenues & Volume, By Integrated Circuits, 2021 - 2031F |
6.3.3 China Copper Wire Bonding ICs Market Revenues & Volume, By Power Devices, 2021 - 2031F |
6.3.4 China Copper Wire Bonding ICs Market Revenues & Volume, By Microelectronics, 2021 - 2031F |
6.3.5 China Copper Wire Bonding ICs Market Revenues & Volume, By Others, 2021 - 2031F |
6.4 China Copper Wire Bonding ICs Market, By End User |
6.4.1 Overview and Analysis |
6.4.2 China Copper Wire Bonding ICs Market Revenues & Volume, By Consumer Electronics, 2021 - 2031F |
6.4.3 China Copper Wire Bonding ICs Market Revenues & Volume, By Automotive, 2021 - 2031F |
6.4.4 China Copper Wire Bonding ICs Market Revenues & Volume, By Aerospace, 2021 - 2031F |
6.4.5 China Copper Wire Bonding ICs Market Revenues & Volume, By Others, 2021 - 2031F |
6.5 China Copper Wire Bonding ICs Market, By Distribution Channel |
6.5.1 Overview and Analysis |
6.5.2 China Copper Wire Bonding ICs Market Revenues & Volume, By Direct Sales, 2021 - 2031F |
6.5.3 China Copper Wire Bonding ICs Market Revenues & Volume, By Distributors, 2021 - 2031F |
6.5.4 China Copper Wire Bonding ICs Market Revenues & Volume, By Online Sales, 2021 - 2031F |
6.5.5 China Copper Wire Bonding ICs Market Revenues & Volume, By Others, 2021 - 2031F |
7 China Copper Wire Bonding ICs Market Import-Export Trade Statistics |
7.1 China Copper Wire Bonding ICs Market Export to Major Countries |
7.2 China Copper Wire Bonding ICs Market Imports from Major Countries |
8 China Copper Wire Bonding ICs Market Key Performance Indicators |
8.1 Average selling price (ASP) of copper wire bonding ICs |
8.2 Adoption rate of copper wire bonding technology in semiconductor manufacturing |
8.3 Number of patents filed for innovations in copper wire bonding technology |
8.4 Percentage of semiconductor companies in China using copper wire bonding ICs |
8.5 Rate of investment in research and development for improving copper wire bonding technology |
9 China Copper Wire Bonding ICs Market - Opportunity Assessment |
9.1 China Copper Wire Bonding ICs Market Opportunity Assessment, By Wire Type, 2021 & 2031F |
9.2 China Copper Wire Bonding ICs Market Opportunity Assessment, By Bonding Process, 2021 & 2031F |
9.3 China Copper Wire Bonding ICs Market Opportunity Assessment, By Application, 2021 & 2031F |
9.4 China Copper Wire Bonding ICs Market Opportunity Assessment, By End User, 2021 & 2031F |
9.5 China Copper Wire Bonding ICs Market Opportunity Assessment, By Distribution Channel, 2021 & 2031F |
10 China Copper Wire Bonding ICs Market - Competitive Landscape |
10.1 China Copper Wire Bonding ICs Market Revenue Share, By Companies, 2024 |
10.2 China Copper Wire Bonding ICs Market Competitive Benchmarking, By Operating and Technical Parameters |
11 Company Profiles |
12 Recommendations |
13 Disclaimer |